一种无氰化学镀金工艺的研究  

Technology Research about Non-cyanide Gold Plating

作　　者：吴赣红[1] 李德良[1] 董坤[1] 曹璟[1] 

机构地区：[1]中南林业科技大学资源与环境学院,湖南长沙410004

出　　处：《表面技术》2008年第3期52-54,86,共4页Surface Technology

基　　金：国家教委留学回国人员资助项目(2004184)

摘　　要：为了确定一种无氰亚硫酸金钠化学镀金的最佳工艺条件，并使其具有工业上的可行性，利用镀层厚度测试和镀层结合力测试等性能检测手段，研究了该工艺中镀液组分和操作条件对镀层的影响。结果表明：当溶液中亚硫酸金钠（以金计）为1～3g/L，亚硫酸钠为13g/L，按乙二胺／Au=（6—10）：1比例投入，磷酸氢二钾为30g/L，pH为8～9，温度为50～60℃时，可以得到光亮均匀的镀金层。In order to determine optimum conditions of a cyanide-free sodium gold sulfite electroless gold plating process and make its have industrial possibility, the effects of solution components and operative condition of this cyanide-free electroless gold plating on coating were studied by coating thickness test and coating binding force test. The resuits show that an optimal condition of the process can prepare a smooth gold coating. The optimized factors are as follows： gold concentration is 1 -3g/L; sodium sulfite concentration is 13g/L;molar ration of ethylenediamine and gold ion is （6 -10）：1, potassium phosphate dibasic concentration is 30g/L,the pH value is 8 -9, the temperature is 50 -60℃.

关 键 词：无氰化学键 亚硫酸金钠 化学镀金 

分 类 号：TQ153.1[化学工程—电化学工业]