脉冲参数对电铸铜组织形态和硬度的影响  

Influence of Pulse Parameters on the Structure and Hardness of Electroforming Copper

作　　者：关丽雅[1] 郑秀华[1] 王富耻[1] 李树奎[1] 王翔宇[1] 吕广庶[1] 

机构地区：[1]北京理工大学材料科学与工程学院,北京100081

出　　处：《电镀与精饰》2008年第6期1-5,共5页Plating & Finishing

摘　　要：采用脉冲电源,酸性硫酸铜电铸液,研究脉冲电流密度和占空比对电铸层组织形貌及硬度的影响。结果表明,在80%占空比条件下,电流密度从3 A/dm2升高到5 A/dm2,铸层晶粒细化、平均硬度升高;而在电流密度为5 A/dm2情况下,占空比由50%提高到80%,铸层晶粒细化。在电流密度5A/dm2、占空比80%、频率200 H z条件下,可获得约600μm厚的细晶铸层,晶粒直径小于10μm。Electroforming experiments were carried out by using pulsed power and CHSO4 solution to examine the influence of current density and duty cycle ratio on the microstructure and hardness of electroformed layer. The results show that at high duty cycle ratio of 80% the grain size reduces and hardness increases as current density increases from 3 A/dm^2 to 5 A/dm^2. At high current density of 5 A/dm^2 the grain size decreases with the increase of duty cycle ratio from 50% to 80%. The copper layer with a thickness of about 600 μm and grain structure of about 10 μm in diameter could be obtained at optimized electroforming parameters with current density of 5 A/dm^2 , duty cycle ratio of 80% and frequency of 200 Hz.

关 键 词：脉冲电铸铜 电流密度 占空比 微观结构 硬度 

分 类 号：TQ153.44[化学工程—电化学工业]