氨基磺酸盐镀液在结晶器铜板电镀中的应用  

Application of Sulphamate Baths in Electroplating on Crystallizer Copper Plate

作　　者：曹旭[1] 李宁[1] 黎德育[1] 蒋丽敏[2] 黄丽[2] 

机构地区：[1]哈尔滨工业大学应用化学系,黑龙江哈尔滨150001 [2]宝钢设备检修有限公司宝钢机械厂,上海201900

出　　处：《电镀与精饰》2008年第6期21-24,33,共5页Plating & Finishing

摘　　要：简介了结晶器在板坯连铸中的应用,以连铸机结晶器表面处理为例,概述了氨基磺酸盐电镀Ni、Ni-Fe合金和Co-Ni合金镀层。镀层内应力小且硬度适中,镀厚性好。与裸Cr-Zr-Cu板相比,提高结晶器寿命2倍以上。合金镀层的综合性能比Ni镀层更高,将得到越来越广泛的应用。The application of crystallizer in the cast of slab mould was briefly introduced. Electrodeposition of the metals such as Ni, Ni-Fe alloy and Co-Ni alloy in sulphamate electrolyte bath for the surface treatment of crystallizer was summarized. The characteristics of deposits from sulphamate electrolyte bath are low internalstress and moderate hardness. High solubility of the sulphamate nickel are responsible for a relatively higher rate plating. The life of crystallizer can be 2 times as long as the nude Cr- Zr- Cu sheet. Among the three kinds of coatings, the alloy coatings have better synthesis performance than Ni, so they will have wide development and application range.

关 键 词：氨基磺酸盐 结晶器 电镀 内应力 镀厚 

分 类 号：TQ153.14[化学工程—电化学工业]