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作 者:吴琼[1] 卫国英[1] 余云丹[1] 葛洪良[1]
机构地区:[1]中国计量学院材料科学与工程学院,浙江杭州310018
出 处:《电镀与涂饰》2008年第6期1-3,共3页Electroplating & Finishing
基 金:国家自然科学基金项目(20571067和20601024)
摘 要:在由0.1mol/L Co(NH2SO3)2、0.01mol/LPt(NO2)2(NH3)2和0.1mol/L NH2CH2COOH组成的镀液中,通过循环伏安法得到了Co2+和Pt2+在铜基底上的沉积电位。利用单槽电位脉冲沉积法制备了Co/Pt多层膜,并研究了脉冲电位对薄膜结构和磁性能的影响。结果表明:脉冲上限电位和下限电位相差较小时,Co/Pt磁性薄膜具有取向生长的fcc相结构,界面合金的形成使其具有较大的垂直各向异性和矫顽力。通过计算δM曲线,揭示在脉冲上限电位为–0.6V、下限电位为–0.95V的条件下制备的Co/Pt多层膜中存在交换耦合作用,产生了剩磁增强效应。The electrodeposition potentials of Co^2+ and Pt^2+ on Cu substrate in a bath containing 0.1 mol/L Co(NH2SO3)2, 0.01 mol/L Pt(NO2)2(NH3)2 and 0.1 mol/L NH2CH2COOH were obtained by cyclic voltammetry. Co/Pt multilayered films were prepared by pulse electrodeposition in a single cell, and the effect of electrodeposition potential on the structure and magnetic properties of the thin films were studied. The results showed that the Co/Pt multilayer prepared with less potential difference between the upper and lower limits has an fcc phase structure, exhibiting strong perpendicular anisotropy and high coercivity due to the formation of interracial alloy. The calculation of delta-M plot indicated that an exchange coupling occurs among the grains in the magnetic Co/Pt multilayered film prepared at an upper limit potential of -0.6 V and a lower limit potential of -0.95 V, causing an remanent enhancement.
分 类 号:TQ153.19[化学工程—电化学工业]
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