高速磨削陶瓷窄深槽加工工艺的研究  

Research on high speed grinding technology of narrow-deep slot on ceramic base panel

作　　者：王爱珍[1] 王战[1] 

机构地区：[1]郑州磨料磨具磨削研究所,郑州450013

出　　处：《金刚石与磨料磨具工程》2008年第3期78-80,共3页Diamond & Abrasives Engineering

摘　　要：本文进行了陶瓷基板上高速磨削加工宽0．10-0.01^0mm、深0．2～0．4mm窄深槽工艺试验研究，得出能够满足加工要求的最佳工艺参数是：主轴转速35000r／min，进给速度35min／s。同时推荐了可用的参数范围：主轴转速33000～36500r／min，工作台进给速度20～40min／s。在生产现场，采用推荐的最佳主轴转速和进给速度，进行了磨深0．21mm的验证实验，对加工出的窄深槽在50倍的投影仪上进行了检测，缝宽0．095mm，没有可以观察到的崩口，达到了技术要求。During the manufacture of ceramic panels, width 0.10-0.01^0,0.2 N 0.4 mm deep slots are needed to be machined in the designed zone. The slots should have no or minimun chip breaking. In this paper , grinding technology of such narrow-deep slots is studied. Optimized technical parameters were obtained which are spindle speed 35000 r/min, feed speed 35 mm/s. An adaptable range of technical parameters were recommended which are spindle speed 33000 - 36500 r/min, worktable feed speed 20 -40 mm/s. With the optimal spindle speed and feed speed recommended above, a verification test of 0.21 mm deep slot grinding was conducted in a factory. The machined narrow-deep slot, observed under 50 × projector, was of 0. 095 mm width, and no visible breakup. That has satisfied the expected technology requirement.

关 键 词：高速磨削 窄深槽 陶瓷 

分 类 号：TG58[金属学及工艺—金属切削加工及机床]