The optimization model of the heat conduction structure  

作　　者：Yongcun Zhang Shutian Liu 

机构地区：[1]State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, China

出　　处：《Progress in Natural Science:Materials International》2008年第6期665-670,共6页自然科学进展·国际材料（英文版）

基　　金：the National Natural Science Foundation of China（Grant Nos. 10332010,10721062）；the National Key Basic Research Program of China （Grant No.2006CB601205）；the Program for New Century Excellent Talents in the University of China （2004）.

摘　　要：An optimization model considering a novel thermal performance index to be the objective function is proposed for minimizing the highest temperature in this paper.Firstly,the performance of the conventional heat conduction optimization model,with the dissipation of heat transport potential capacity as the objective function,is evaluated by a one-dimensional heat conduction problem in a planar plate exchanger.Then,a new thermal performance index,named the geometric average temperature,is introduced.The new heat con-duction optimization model,with the geometric average temperature as the objective function,is developed and the corresponding finite element formula is presented.The results show that the geometric average temperature is an ideal thermal performance index and the solution of the new model is close to the theoretical optimal solution.An optimization model considering a novel thermal performance index to be the objective function is proposed for minimizing the highest temperature in this paper. Firstly, the performance of the conventional heat conduction optimization model, with the dissipation of heat transport potential capacity as the objective function, is evaluated by a one-dimensional heat conduction problem in a planar plate exchanger. Then, a new thermal performance index, named the geometric average temperature, is introduced. The new heat con- duction optimization model, with the geometric average temperature as the objective function, is developed and the corresponding finite element formula is presented. The results show that the geometric average temperature is an ideal thermal performance index and the solution of the new model is close to the theoretical optimal solution.

关 键 词：Optimization Heat conduction structure Dissipation of heat transport potential capacity Geometric average temperature Planar plate exchanger 

分 类 号：O44[理学—电磁学]