超高精度大直径硅片表面超声浮动抛光  

Research on large diameter silicon surface grinding using ultrasonic float polishing

作　　者：陈洁[1] 

机构地区：[1]苏州市职业大学机电工程系,江苏苏州215104

出　　处：《辽宁工程技术大学学报（自然科学版）》2008年第3期413-416,共4页Journal of Liaoning Technical University (Natural Science)

基　　金：国家863基金资助项目(2003AA430190)

摘　　要：为了提高大直径硅片表面质量,利用超声浮动抛光加工宏观磨削力、磨削应力、磨削热小,对加工材料表面损伤低的特点,再结合相关磨料对超高精度大直径硅片表面进行超声浮动抛光加工。在工作机理研究的基础上,对大直径硅片超声浮动抛光加工进行了实验研究,优化了其工作参数,获得了满意的效果,为该技术的实际应用奠定了理论与实验基础。To improve the surface grinding quality of large diameter silicon, ultrasonic floating polishing is carried on super accurate and large diameter silicon with special abrasive using the advantages of ultrasonic float Polishing method （e.g. small macroscopic grinding force, small grinding stress, little grinding heat and low surface damage）. The corresponding parameters are optimized based on the experimental data. The satified result is reached and theorical and expermental foundation is set up for the pratical application.

关 键 词：大直径硅片 超声磨削 超声浮动抛光 

分 类 号：TH132[机械工程—机械制造及自动化]