考虑空洞效应的共晶钎料合金粘塑性-损伤本构模型  

Viscoplastic Mechanics Constitutive Model Incorporating Void Damage for Pb/Sn Solder Alloys

作　　者：周俊[1] 郝伟娜[1] 柴国钟[1] 

机构地区：[1]浙江工业大学,杭州310014

出　　处：《应用力学学报》2008年第2期332-335,共4页Chinese Journal of Applied Mechanics

基　　金：浙江省高校创新基地资助项目

摘　　要：在温度298K^398K和恒应变率10-5/s^10-3/s范围内进行一系列的拉伸实验,研究共晶焊料的力学行为,揭示空洞成核和生长变形机理的存在。提出一种考虑孔洞效应的粘塑性-损伤模型,基于Guron-Tvergaard-Needleman思想和正交法则,引入孔洞体积分数作为损伤变量以描述共晶钎料的力学特性。与实验数据比较,验证粘塑性-损伤模型对锡铅合金在恒应变率和稳态塑性流动条件下应力应变行为的预测能力。结果表明,该模型能够有效描述共晶焊料的本构行为:非线性、应变率敏感性、空洞损伤演化,并可用于分析电子封装中焊点的可靠性问题。The experiments in tension on eutectic SnPb material have been are carried out under various constant true strain rates ranging from 10E-5/s to 10E-3/s and at 298K～423K. Based on the experimental results the mechanical behavior of the material is investigated to reveal the presence of both the nucleation and growth deformation mechanisms of voids. A viscoplastic-damage constitutive model with void effects is proposed. Following the Gurson-Tvergaard-Needleman plastic potential equation and the orthogonal rules, the effect of void volume fraction is introduced into the material constitutive law to describe the mechanics behavior of eutectic solder alloy. Comparing with the various test data, it is verified that the capability of the viscopalstic model is capable of predicting stress-strain behaviors of eutectic SnPb solder under constant strain rate testing and steady state plastic flow.

关 键 词：损伤力学 孔洞损伤 共晶焊点 本构模型 

分 类 号：TG113.8[金属学及工艺—物理冶金]