Z-pins增强陶瓷基复合材料单搭接接头的裂纹尖端能量释放率  

Strain Energy Release Rate of Z-pins Reinforced Ceramic Matrix Composite Single Lap Joint at Crack Tips

作　　者：陶永强[1] 矫桂琼[1] 

机构地区：[1]西北工业大学,西安710072

出　　处：《应用力学学报》2008年第2期347-350,共4页Chinese Journal of Applied Mechanics

基　　金：自然科学基金(90405015);高等学校博士学科点专项科研基金(20030699040)

摘　　要：对典型Z-pins增强陶瓷基复合材料单搭接接头的裂纹尖端能量释放率进行了数值模拟,重点研究Z-pins在不同直径和间距下裂纹尖端能量释放率随裂纹扩展的变化规律。研究发现能够形成桥联的Z-pins具有一定抑制开裂的能力,形成桥联后,Z-pins的直径对于裂纹尖端能量释放率的影响较大,而Z-pins的间距对于裂纹尖端能量释放率也有影响,但当间距小到某一限度时,再减小间距裂纹尖端能量释放率基本保持不变。Energy release rate of the single lap joint reinforced by Z-pins at crack tip is investigated, especially for different diameter and density of z-pins. Energy release rate completely reflects the effect of restraining crack growing, and the restraining extent is related with Z-pins diameter and density. Z-pins density gets great enough, restraining effect remains almost steady.

关 键 词：陶瓷基复合材料 连接 Z-PINS 能量释放率 

分 类 号：TB332[一般工业技术—材料科学与工程]