工艺参数对电沉积纳米晶镍沉积速率的影响  

Effect of technology parameters on rate of electrodeposition of nanocrystalline nickel

作　　者：康进兴[1] 赵文轸[1] 徐英鸽[2] 孙立明[1] 

机构地区：[1]西安交通大学材料科学与工程学院 [2]西安建筑科技大学机电学院,陕西西安710055

出　　处：《材料热处理学报》2008年第3期152-155,共4页Transactions of Materials and Heat Treatment

摘　　要：采用直流电沉积方法,通过改变电流密度、沉积液温度、特殊添加剂C7H4NO3SNa.2H2O浓度,制备出纳米晶镍覆层材料,利用光学显微镜和高分辨透射电镜(HRTEM)对沉积覆层材料的组织形貌进行分析,通过对沉积层材料厚度的测量,研究不同条件下纳米晶镍覆层沉积速率的变化规律。结果表明:电沉积纳米晶镍覆层材料的沉积速率随着电流密度的增加而呈现增加的趋势;随着温度的增加,先增加后下降,在60℃时最大;随着特殊添加剂浓度的增加而降低。Electrodeposited nanocrystalline nickel coatings were prepared using direct current deposition method by changing the current density, bath temperature and concentrations of the special additive C7 H4 NO3 SNa·2H2O. The microstructure was evaluated by means of optical microscope and high-resolution transmission electron microscopy （HRTEM） .The effect of technology parametes on the rate of electrodeposition was studied. The results show that the rate of electrodeposition increases discontinuously with increasing current density. The rate of electrodeposition increases firstly and then drops with increase of temperature,and the maximum rate is obtained at 60℃. The rate of deposition reduces with the increasing of the concentration of the special additive.

关 键 词：纳米晶镍 沉积速率 电流密度 直流电沉积 

分 类 号：TQ153.12[化学工程—电化学工业]