化学镀铜聚酯微粉的表面形态和导电性能  

Surface Morphology and Electrical Conductive Properties of Cu-Coated Polyester Powder Prepared by Electroless Plating

作　　者：彭俊华[1] 伍伯林[1] 冯小明[1] 谭松庭[1] 

机构地区：[1]湘潭大学化学学院,湖南湘潭411105

出　　处：《高分子材料科学与工程》2008年第7期74-76,81,共4页Polymer Materials Science & Engineering

摘　　要：通过化学镀方法，制备了一种镀铜的聚酯微米级粉体，利用X射线衍射仪和热台光学显微镜对其表面成分和形貌进行了研究，该粉体在25℃-300℃内具有较好的热稳定性。将镀铜聚酯微粉与环氧树脂共混制备导电胶，其导电性能测试结果表明，用硬脂酸包覆处理的镀铜聚酯粉体抗氧化性好，添加质量分数为50％的硬脂酸处理镀铜聚酯微粉制备的导电胶体积电阻率为1.6×10^-3Ω·cm，在25℃-120℃之内其体积电阻率变化在20％以下，是一种较好的常温导电填料。A Cu-coated polyester powder was prepared by electroless plating technique. The composition and morphology of the powder surface were studied by XRD and microscopy with a hot stage. The Cu-coated polyester powder possesses a good heat resistances between 25℃-300℃. A electrical conductivity adhesive was obtained by blending epoxy resin and Cu-coated polyester powder. The electrical conductive property of the conductive adhesive was measured, and the results showed that the conductive ability of conductivity adhesive which obtained by using of stearic acid treated Cu-coated polyester powder is enhanced. The volume resistivity of conductive adhesive is 1.6×10^-3Ω·cm when the mass percentage of Cu-coated polyester powder treated by stearic acid is 50 wt% , and the change of volume resistivity is under 20% in the range of 20℃-120 ℃. It＇s a good electrical conductive filling at normal temperature.

关 键 词：聚酯粉体 化学镀 导电性能 

分 类 号：TQ323.4[化学工程—合成树脂塑料工业] TQ153.14