溶胶-凝胶制备技术与新型催化材料Ⅳ.用新的化学镀饰过程制备钯金属复合膜  

NOVEL CATALYTIC MATERIALS FROM SOLGEL TECHNIQUE Ⅳ. Palladium Composite Membrane Prepared by Novel Electroless Plating Procedure

作　　者：赵宏宾[1] 李安武[1] 谷景华 盛世善 熊国兴[1] 

机构地区：[1]中国科学院大连化学物理研究所催化基础国家重点实验室

出　　处：《催化学报》1997年第6期449-453,共5页

基　　金：国家科委和国家自然科学基金;中国科学院"八五"基础重点课题

摘　　要：提出钯金属复合膜制备的一种新化学镀饰过程，由衬底活化和金属自催化沉积两个主要步骤构成．一般的化学镀饰过程用Ｐｄ（Ⅱ）／Ｓｎ（Ⅱ）溶液的氧化还原反应活化目标衬底；新的化学镀饰过程是应用溶胶－凝胶技术活化目标衬底，从而明显地简化了镀饰过程．用新的化学镀饰过程制得的钯金属复合膜避免了Ｓｎ杂质；在温度３１４～４５０℃和膜两侧的压力差００２～０１０ＭＰａ的实验条件下，对氢的选择性（氢氮分离系数）为２０～１３０，氢的渗透速率为００５～２４ｃｍ３／（ｃｍ２·ｓ）．A novel electroless plating procedure has been proposed to prepare palladium/ceramic composite membrane. In general, an electroless plating process consists of activation of a substrate and deposition of palladium on it. In a conventional electroless process, the activation of a substrate is performed by the oxidationreduction of Pd(Ⅱ) with Sn(Ⅱ). However, in this work the solgel process with Pd(Ⅱ)modified sol was employed to produce an activated substrate. Thus the modified electroless plating procedure becomes more convenient, and Snfree palladium composite membrane can be realized using the novel method. Pure gas permeation experiment shows that the resulting membrane exhibited a permeation rate of 005～24 cm3/(cm2·s) and a H2selectivity (H2/N2 ratio) of 20～130 at 314～450℃ and 002～010 MPa transmembrane pressure drop.

关 键 词：钯复合膜 溶胶 凝胶 化学镀饰 氢 分离 膜反应器 

分 类 号：TQ426.64[化学工程] TQ426.8