电沉积工艺参数对块体纳米晶镍硬度的影响  

Effect of Electrodeposited Technology Parameter on Hardness of Bulk Nanocrystalline Nickel

作　　者：康进兴[1] 赵文轸[1] 徐英鸽[2] 孙立明[1] 

机构地区：[1]西安交通大学材料科学与工程学院 [2]西安建筑科技大学机电学院,西安710055

出　　处：《材料工程》2008年第7期40-42,46,共4页Journal of Materials Engineering

摘　　要：采用直流电沉积方法,通过改变特殊添加剂C7H4NO3SNa.2H2O浓度、电流密度、沉积液温度,制备出不同硬度的块体纳米晶镍覆层材料,利用高分辨透射电子显微镜(HRTEM)对沉积覆层材料的组织形貌进行分析,利用显微硬度计测量沉积层材料的显微硬度,对块体纳米晶镍硬度的变化规律进行分析。结果表明:通过改变工艺参数,可获得结构致密,组织均匀的块体纳米晶覆层材料。块体纳米晶镍的硬度随着添加剂C7H4NO3SNa.2H2O浓度的增加而增加;随电流密度的增加,呈现增加趋势,在700A.m-2至1100A.m-2范围内,基本保持不变;随着温度的增加而下降。Bulk nanocrystalline nickel was fabricated using the method of direct current deposition by changing the concentrations of the special additive C7H4NO3SNa·2H2O, current density and bath temperature. The microstructure of electrodeposits was evaluated by means of high-resolution transmission electron microscopy （HRTEM）. The micro-hardness of electrodeposits was measured. Law of micro-hardness varying was studied. The results show that the bulk nanocrystalline nickel coatings of uniform structure are fabricated by changing parameters of technology. The micro-hardness increases with the increasing of the concentrations of the additive C7H4NO3SNa·2H2O. The micro-hardness increases with increasing of the current density. The micro-hardness almost doesn＇t increase with increasing of the current density between 700A·m^-2 and 1100A·m^-2. The micro-hardness reduces with increasing of the temperature.

关 键 词：直流电沉积 硬度 纳米晶镍 块体材料 

分 类 号：TG174.441[金属学及工艺—金属表面处理]