预设升温速度对W-Cu合金性能的影响  

Effect of preset heating rate on the properties of W-Cu alloys under the action of electric field

作　　者：连姗姗[1] 冯可芹[1] 杨屹[1] 吴金岭[1] 计芳[1] 

机构地区：[1]四川大学制造科学与工程学院,四川成都610065

出　　处：《电子元件与材料》2008年第7期40-43,共4页Electronic Components And Materials

基　　金：国家自然科学基金青年基金资助项目(No.50404014);中国博士后科学基金资助项目(No.20060390177)

摘　　要：采用Gleeble—3500D热模拟机,通过对烧结体密度、显微结构以及硬度的分析,研究了电场作用下预设升温速度对W-20Cu体系快速烧结的影响。结果表明:W-20Cu复合粉在800℃、较短时间(3min)内进行快速烧结可得到烧结性能良好、平均晶粒尺寸约0.4μm的W-Cu合金;并且随着预设升温速度的提高,电场的作用愈强,压坯所获得的热流密度愈大,这有利于烧结体的致密化;同时,预设升温速度的提高,合金的硬度呈递增趋势。Using Gleeble--3500D thennal simulation equipment, the effect of preset heating rate on rapid sintering of W-20Cu system under the action of electric field was investigated. According to the analysis of sintered compacts＇ density, microstructure and hardness, the results show that better sintering property and the average grain size of 0.4 um are obtained after rapid sintering at 800 ℃ for a short time （3 min）; meanwhile, along with preset heating rate＇s increase, the action of the electric field is stronger, the current density is greater, so which is beneficial to improving density; and sintered compacts＇ hardness is gradually increasing as the rise of preset heating rate.

关 键 词：金属材料 W-20Cu合金 快速烧结 电场 烧结性能 

分 类 号：TG146[一般工业技术—材料科学与工程]