半导体激光器焊接的热分析  

Thermal Analysis of the Semiconductor Lasers Welding

作　　者：王辉[1] 王德宏[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《微纳电子技术》2008年第7期428-431,共4页Micronanoelectronic Technology

基　　金：国家部委基金资助项目

摘　　要：为了解决大功率半导体激光器的散热问题,利用有限元软件ANSYS,采用稳态热模拟方法,分析了半导体激光器内部的温度分布情况,对比分析了In、SnPb、AuSn几种不同焊料烧结激光器管芯对激光器热阻的影响。由模拟结果可见,焊料的厚度和热导率对激光器热阻影响很大,在保证浸润性和可靠性的前提下,应尽量减薄焊料厚度。另外,采用高导热率的热沉材料和减薄热沉厚度可有效降低激光器热阻。在这几种焊接方法中,采用In焊料Cu热沉焊接的激光器总热阻最小,是减小激光器热阻的最佳选择。通过光谱法测出了激光器热阻,验证了模拟结果,为优化激光器的封装设计提供了参考依据。In order to solve the heat radiation of high power semiconductor lasers, the internal thermal distribution of the lasers and the influence of the laser diodes sintered by different solders （In, SnPb, AuSn） on the thermal resistance of the lasers were analyzed by ANSYS finite element software and the steady thermal simulation method. The simulation results show that the thickness and thermal conductivity of the solders are the main factors impacting the thermal resistance. On the premise of ensuring wettability and reliabilities, the thickness of the solders should be decreased. The thermal resistance of the lasers can be reduced effectively by using heat sink materials of high thermal conductivity and thinning its thickness. Of several welding methods, the total thermal resistance of the lasers sintered by In solder and Cu carrier is minimum, and the method is the best selection to reduce the thermal resistance of the lasers. The actual values of thermal resistance were obtained by spectrographic analysis, and the simulation results were validated. The obtained conclusion can help to optimize packaging design of the lasers.

关 键 词：大功率半导体激光器 焊料 热模拟 热阻 光谱法 

分 类 号：TN365[电子电信—物理电子学]