工艺参数对甲基磺酸盐镀锡铅合金的影响  

Effects of technological parameters on methane-sulfonate tin-lead alloy electroplating

作　　者：黄选民[1] 幸泽宽[1] 赵云强[1] 

机构地区：[1]中国人民解放军第5719厂,四川成都611937

出　　处：《电镀与涂饰》2008年第7期7-9,共3页Electroplating & Finishing

摘　　要：讨论了主盐、甲基磺酸用量,电流密度,温度,搅拌速率等工艺参数对甲基磺酸盐电镀锡铅合金的影响。结果表明,增大电流密度会改变镀层中合金比例;加大搅拌速率会使铅更容易沉积;镀液温度不会引起合金比例的较大变化,但升温会使沉积加快。在最佳工艺条件下,所得锡铅合金的锡含量及镀层厚度较稳定。?The effects of technological parameters, such as the dosages of main salts and methanesulfonic acid, current density, temperature and stirring rate on the electroplating of Sn-Pb alloy in a methanesulfonate electrolyte were discussed The results showed that the increase of current density changes the alloy proportion of deposit. A high stirring rate facilitates the deposition of Pb. The bath temperature does not cause a large variation of alloy proportion, but the deposition rate is increased with increasing temperature. The Sn content and thickness of Sn-Pb alloy coating are stable under optimized process conditions.

关 键 词：锡铅合金 电镀 甲基磺酸盐 工艺参数 

分 类 号：TQ153.2[化学工程—电化学工业]