电镀仿金工艺的研究进展  

Progress in Technology of Imitation Gold Plating

作　　者：梁成浩[1] 余向飞[2] 

机构地区：[1]大连海事大学机电与材料工程学院,辽宁大连116026 [2]大连理工大学化工学院,辽宁大连116012

出　　处：《电镀与环保》2008年第4期1-4,共4页Electroplating & Pollution Control

摘　　要：综述了国内外关于电镀铜锌合金仿金工艺的现状,系统归纳含氰和无氰电镀仿金的配方。着重对无氰镀液成分、工艺流程以及后处理进行分析和比较,最后对电镀仿金工艺的发展趋势进行了展望。The present processes for imitation gold plating of Cu Zn alloy are reviewed, and the formulas for cyanide and non cyanide imitation gold plating techniques are systematically summarized. Especially, the bath compositions, technological process and post treatment for non-cyanide imitation gold plating are analyzed and compared. Finally, the development trend of imitation gold plating processes is prospected.

关 键 词：仿金电镀 工艺 发展前景 

分 类 号：TQ153.2[化学工程—电化学工业]