聚酰亚胺胶粘剂的改性研究  

Study on modification of polyimide adhesive

作　　者：毕辉[1] 寇开昌[1] 吴海维[1] 王志超[1] 张教强[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710072

出　　处：《中国胶粘剂》2008年第7期44-49,共6页China Adhesives

基　　金：陕西省自然基金(N6CS0005);西北工业大学创新基金(07035)

摘　　要：介绍了聚酰亚胺(PI)胶粘剂改性的研究进展,详细讨论了缩合型PI胶粘剂、热塑性PI胶粘剂和加成型PI胶粘剂的发展现状、最新进展、性能(物理机械性能、耐热性、耐化学性和成型加工性)及其在各领域中的应用。总结了PI胶粘剂存在的具体问题和未来的发展趋势。The research developments for the modification of polyimide （PI） adhesive were introduced,the development actuality, the recent research progress ,performance （physical mechanical properties, heat-resistance properties,chemistry-resistant properties and molding process） of polycondensation PI adhesive,thermoplastic PI adhesive and polyaddition PI adhesive and their applications in various fields were discussed in detail. In addition, the existent problems about PI adhesive in relevant fields and future research developments trend were summarized.

关 键 词：聚酰亚胺 改性 胶粘剂 

分 类 号：TQ433.9[化学工程]