基于ARM9的高精度动态测厚系统  

Design of Dynamic Thickness Measure System with High-resolution Based on ARM9

作　　者：邱宝梅[1] 王建文 

机构地区：[1]重庆邮电大学自动化学院,重庆400065 [2]中电科技集团26所,重庆400060

出　　处：《仪表技术与传感器》2008年第6期38-40,43,共4页Instrument Technique and Sensor

摘　　要：针对高精度非接触式动态测厚方法的不足,提出了基于ARM9微处理器的硬件设计方案,对锂电池两表面的铝薄膜(或铜薄膜)的炭粉厚度进行了非接触式高精度的快速动态测量,系统采用1对CCD激光位移传感器,采用特殊的测量方法。控制系统以ARM9微处理器为主控核心,设计了相应的外围扩展电路,主要有LCD接口电路、电机控制电路、CCD激光位移传感器接口电路等,采用了操作系统μC/OS-II和嵌入式图形系统μC/GUI,并介绍了其在系统中的运行机制,基于C语言编写了相关软件。系统在实际生产中应用良好,与传统的方法比较,提高了生产效率,改善了生产状况。Aiming at improving on the disadvantages of the conventional dynamic methods for thickness measurement with high-resolution and no physical contact in industry, this paper presented a set of hardware design based on ARM9 microprocessor. It can be used on measuring the thickness of carbon coat of aluminum （or copper） film on the surface of a lithium battery. This dynamic thickness measurement method was efficient with high-resolution and no physical contact since it used a CCD laser dis- placement sensor and took a special technique in the system. With ARM9 microprocessor as the core of the control system, it contained an expanded peripheral circuit including LCD interface circuit, motor control circuit, CCD laser displacement sensor inter- face circuit, etc. The system was based on the embedded μC/OS-Ⅱ operating system and embedded graph system μC/GUI which were also mainly introduced in this paper. This design adopted the basic C language to compile the software of the system. As compared with the conventional thickness measurement method, the system is in good condition and it gains a great improvement on the measurement accuracy and efficiency.

关 键 词：ARM9 CCD激光位移传感器 μC/OS-Ⅱ ΜC/GUI 

分 类 号：TP273[自动化与计算机技术—检测技术与自动化装置]