用苯乙烯-马来酸酐固化环氧树脂  

Epoxy Resin Cured by SMA

作　　者：高延敏[1] 李照磊[1] 王鹏[1] 

机构地区：[1]江苏科技大学江苏省先进焊接技术重点实验室,镇江212003

出　　处：《应用化学》2008年第8期998-1000,共3页Chinese Journal of Applied Chemistry

摘　　要：通过FT-IR和DSC技术研究了甲基咪唑(MeIm)作为促进剂时,苯乙烯-马来酸酐共聚物(SMA)与环氧树脂的固化过程。用DTA-TG研究了其耐热性能。用SEM观察了固化产物的表面形态。讨论了该固化过程的机理。结果表明,SMA可以单独作为作为环氧树脂的固化剂使用,甲基咪唑(MeIm)作为促进剂时,能使固化反应的温度降低近10℃,且固化产物能耐将近400℃的高温。固化产物为两相结构:连续相为环氧树脂,分散相为SMA。The curing of epoxy resin with SMA as the curing agent and MeIm as the accelerator was studied by FT-IR and DSC, and the thermal stability of the resin was studied by DTA-TG analysis. The surface morphology of the cured product was studied by SEM. The curing mechanism was discussed. The result indicates that SMA can be used alone as the curing agent for epoxy resin, and the curing temperature could be decreased by 10 ℃ when MeIm was added as an accelerator, and the cured product exhibited thermal stability at below 400 ℃. There were two phases in the cured product, the continuous phase being epoxy and the dispersed phase being SMA.

关 键 词：环氧树脂 SMA 固化 耐温性 

分 类 号：O631[理学—高分子化学]