The multi-motion-overlap algorithms for minimizing the time between successive scans of wafer stage  

作　　者：潘海鸿 Chen Lin Li Xiaoqing Zhou Yunfei 

机构地区：[1]College of Mechanical Engineering, Guangxi University, Nanning 530004, P.R. China [2]College of Mechanical Science ＆ Engineering, Huazhong University of Science ＆ Technology, Wuhan 430074, P. R. China

出　　处：《High Technology Letters》2008年第3期282-288,共7页高技术通讯（英文版）

基　　金：the National Basic Research Program of China(No.2003CB716206);the National Natural Science Foundation of China(No.50605025)

摘　　要：In order to optimize the transitional time during the successive exposure scans for a step-and-scan lithography and improve the productivity in a wafer production process, an investigation of the motion trajectory planning along the scanning direction for wafer stage was carried out. The motions of wafer stage were divided into two respective logical moves （i. e. step-move and scan-move） and the multi-motionoverlap algorithms （MMOA） were presented for optimizing the transitional time between the successive exposure scans. The conventional motion planning method, the Hazelton method and the MMOA were analyzed theoretically and simulated using MATLAB under four different exposure field sizes. The results show that the total time between two successive scans consumed by MMOA is reduced by 4.82%, 2.62%, 3.06% and 3.96%, compared with those of the conventional motion planning method; and reduced by 2.58%, 0.76%, 1.63% and 2.92%, compared with those of the Hazehon method respectively. The theoretical analyses and simulation results illuminate that the MMOA can effectively minimize the transitional step time between successive exposure scans and therefore increase the wafer fabricating productivity.In order to optimize the transitional time during the successive exposure scans for a step-and-scanlithography and improve the productivity in a wafer production process,an investigation of the motion tra-jectory planning along the scanning direction for wafer stage was carried out.The motions of wafer stagewere divided into two respective logical moves(i.e.step-move and scan-move)and the multi-motion-overlap algorithms(MMOA)were presented for optimizing the transitional time between the successive ex-posure scans.The conventional motion planning method,the Hazehon method and the MMOA were ana-lyzed theoretically and simulated using MATLAB under four different exposure field sizes.The resultsshow that the total time between two successive scans consumed by MMOA is reduced by 4.82%,2.62%,3.06% and 3.96%,compared with those of the conventional motion planning method;and re-duced by 2.58%,0.76%,1.63% and 2.92%,compared with those of the Hazelton method respec-tively.The theoretical analyses and simulation results illuminate that the MMOA can effectively minimizethe transitional step time between successive exposure scans and therefore increase the wafer fabricatingproductivity.

关 键 词：multi-motion-overlap algorithm minimizing time successive exposure scans wafer stage step-and-scan lithography 

分 类 号：TP301.6[自动化与计算机技术—计算机系统结构]