3,3,-二乙基-4,4,-二苯甲烷型多马来酰亚胺/聚苯醚树脂的固化反应研究  

Study on Curing Reaction of Poly(Phenylene Oxide) Resin with a Polymaleimide of Bis(3-ethyl-4-maleimidophenyl)Methane Type

作　　者：柯刚[1] 浣石[1] 肖建华[2] 刘晓国[3] 冯勇跃[4] 

机构地区：[1]广州大学工程抗震研究中心,广东广州510405 [2]广东警官学院治安系,广东广州510440 [3]广州大学化学化工学院,广东广州510006 [4]武汉大学分析测试中心,湖北武汉430072

出　　处：《广东化工》2008年第8期7-9,共3页Guangdong Chemical Industry

基　　金：广州市科技攻关计划资助项目(06A1201012)

摘　　要：热固性聚苯醚(PPO)已成为高性能印制电路板用树脂(PCB)发展的主流。本课题组的前期研究表明,3,3,-二乙基-4,4,-二苯甲烷型多马来酰亚胺(PEDM)/烯丙基化PPO是一种新型高性能PCB用树脂。文章采用红外光谱和裂解气相色谱,对PEDM的含量为PPO 10%的PEDM/烯丙基化PPO树脂的固化反应进行研究,结果表明,PEDM分子的不饱和双键与PPO的烯丙基和羟基在加热过程中发生了反应。Thermosetting poly（phenylene oxide） （PPO） has been the mainstream of development of printed circuit board with high performances.Previous studies in our team showed that polymaleimide of bis（3-ethyl-4-maleimidophenyl）methane type （PEDM）/allylated poly（phenylene oxide） （PPO） resin was a novel resin of printed circuit board. In this study, FTIR and pyrolysis gas chromatograph were combined to analyze curing reaction of the PEDM/allylated PPO resin, in which weight of the P EDM was 10 % of that of the PPO resin. Results showed that unsaturated double bonds of the PEDM molecules reacted with allyl and hydroxyl groups of the PPO in heating process.

关 键 词：聚苯醚 多马来酰亚胺 热同性树脂 固化反应 

分 类 号：TQ326.53[化学工程—合成树脂塑料工业] TQ323.706