印制电路板电镀铜添加剂的研究进展  

Advance in Research of Additives for Acidic Copper Electroplating of PCB

作　　者：朱凤鹃[1] 李宁[1] 黎德育[1] 

机构地区：[1]哈尔滨工业大学应用化学系,黑龙江哈尔滨150001

出　　处：《电镀与精饰》2008年第8期16-20,共5页Plating & Finishing

摘　　要：简述了高密度印制板的关键技术——酸性镀铜,列举了目前运用较广的印制电路板酸性镀铜添加剂产品,介绍了酸性镀铜添加剂的常规组成及其电化学行为。通过对运用于印制电路板电镀的酸性镀铜添加剂的研究进展的综述,认为寻求更新的添加剂复配技术以及开发单体性能更为优秀的中间体是满足目前印制电路板酸性镀铜要求的重要途径。With the improvement in HDI, challenges it brought to acidic copper deposition in PCB manufacturing were told in this article. And the commercial additives with good performance were present here. The composition and their electrochemical activations of the additives in the acidic sulfate copper plating bath widely used in PCB manufacturing were introduced. Looking for new combination technology of additives and developing new mediums for additives with good performance were found to be the important ways to satisfy the requirements of acidic copper plating in the PCB manufacturing.

关 键 词：印制电路板 硫酸盐镀铜 添加剂 

分 类 号：TQ153.14[化学工程—电化学工业]