玻璃上基于自组装和喷墨打印的选位金属沉积  

Selective Deposition of Metal Patterns on Glass Based on Self-assembly and Inkjet Printing

作　　者：王金意[1] 刘冉[2] 蔡文斌[1] 

机构地区：[1]复旦大学化学系,上海分子催化与功能材料重点实验室,上海200433 [2]复旦大学微电子系,上海200433

出　　处：《高等学校化学学报》2008年第8期1644-1646,共3页Chemical Journal of Chinese Universities

基　　金：国家自然科学基金(批准号:20673027);上海市纳米专项基金(批准号:0652nm028);中德'IRTG'项目基金资助

摘　　要：Selective metallization on glass is widely used in the production of printed circuit boards(PCB),display panels and solar cells. Selective masking and etching steps are used in the traditional photolithographic processes to create the regions of metallization on non-conducting substrates; however, these processes require high-cost facilities and complicated operations. To address these issues, a non-photolithographic process to form metal patterns on glass was proposed and put into practice, which combines self-assembly of aminosilane, desktop inkjet printing of a catalyst ink, and selective electroless plating of Au, Cu or Ni-B alloy on the catalyst template to form desired patterns with a minimal line width of about 200 μm. The adherence of the metal layer deposited on glass is significantly enhanced due to the surface modification of self-assembled aminosilane layer. The non-photolithographic approach could be cost-effective for prototype and small patch of production of metallic patterns, simple electric circuits and other electronic device parts.Selective metallization on glass is widely used in the production of printed circuit boards （ PCB）, display panels and solar cells. Selective masking and etching steps are used in the traditional photolithographic processes to create the regions of metallization on non-conducting substrates ; however, these processes require high-cost facilities and complicated operations. To address these issues, a non-photolithographic process to form metal patterns on glass was proposed and put into practice, which combines self-assembly of aminosilane, desktop inkjet printing of a catalyst ink, and selective electroless plating of Au, Cu or Ni-B alloy on the catalyst template to form desired patterns with a minimal line width of about 200 um. The adherence of the metal layer deposited on glass is significantly enhanced due to the surface modification of self-assembled aminosilane layer. The non-photolithographic approach could be cost-effective for prototype and small patch of production of metallic patterns, simple electric circuits and other electronic device parts.

关 键 词：自组装 喷墨打印 选择性化学镀 

分 类 号：O644[理学—物理化学]