配位剂对弱酸性体系电沉积Sn-Ag-Cu镀层的影响  

Effect of complexing agent on electrodeposited Sn-Ag-Cu alloy coating in weakly acidic electrolyte

作　　者：张锦秋[1] 安茂忠[1] 刘桂媛 

机构地区：[1]哈尔滨工业大学应用化学系,黑龙江哈尔滨150001 [2]首钢长白机械有限责任公司,山东秦皇岛066311

出　　处：《电镀与涂饰》2008年第8期5-7,14,共4页Electroplating & Finishing

摘　　要：在含有甲磺酸盐和碘化物的弱酸性镀液中电沉积得到了Sn-Ag-Cu三元合金镀层。研究了该镀液体系中配位剂的用量对Sn-Ag-Cu合金镀层外观和镀液电流效率的影响,探讨了配位剂对镀液阴极极化的影响。结果表明,配位剂K4P2O7、KI、TEA的加入使Sn、Ag、Cu三种金属的沉积电势趋于一致,能够实现共沉积。优化的镀液组成及工艺条件为:0.2mol/L Sn(CH3SO3)2,4.5mmol/L AgI,1.5mmol/L Cu(CH3SO3)2,0.6mol/L K4P2O7,1.35mol/L KI,0.225mol/L TEA,1g/L光亮剂,1g/L抗氧化剂,温度20°C,pH5.5。Sn-Ag-Cu alloy coatings were electrodeposited from weakly acidic baths containing methylsulfonate and iodide. The effect of the concentrations ofcomplexing agents on the surface appearance of Sn-Ag-Cu alloy coatings and the current efficiencies of the baths was studied. The effect of complexing agents on the cathodic polarization of tile baths was discussed. The results showed that by adding K4P2O7, KI and TEA as complexing agents, the deposition potentials of Sn, Ag and Cu tend to be the same and the codeposition of these metals is realized. The optimized bath composition and electroplating conditions are： 0.2 mol/L Sn（CH3SO3）2, 4.5 mmol/L AgI, 1.5 mmol/L Cu（CH3SO3）2, 0.6 mol/L K4P2O7, 1.35 mol/L KI, 0.225 mol/L TEA, 1 g/L brightening agent, 1 g/L antioxidant, temperature 20 ℃ and pH 5.5.

关 键 词：锡-银-铜合金 电沉积 配位剂 无铅 阴极极化 

分 类 号：TQ153.2[化学工程—电化学工业]