3，3′-二乙基-4，4′-二苯甲烷型多马来酰亚胺改性聚苯醚树脂的制备和性能  

Preparation and Performance of Poly(Phenylene Oxide) Resin Modified with a Polymaleimide of Bis(3-Ethyl-4-Maleimidophenyl)Methane Type

作　　者：柯刚[1,2] 浣石[1] 刘晓国[3] 刘自力[3] 郑成[3] 冯勇跃[4] 

机构地区：[1]广州大学工程抗震研究中心,教育部工程抗震减震与结构安全重点实验室,广东广州510405 [2]湖北省化学研究院,湖北武汉430074 [3]广州大学化学化工学院,广东广州510006 [4]武汉大学分析测试中心,湖北武汉430072

出　　处：《高分子材料科学与工程》2008年第8期147-150,共4页Polymer Materials Science & Engineering

基　　金：广州市科技攻关引导项目(06A1201012)

摘　　要：首次将两种高性能印制电路板(PCB)用树脂——聚苯醚(PPO)和多马来酰亚胺(PMI)相结合,以烯丙基化PPO为基础树脂,采用质量为PPO的10%的3,3′-二乙基-4,4′-二苯甲烷型多马来酰亚胺(PEDM)作为交联剂,无引发剂热聚合得到一种新型热固性PPO树脂。PEDM改性烯丙基化PPO固化树脂的Tg为204.71℃,介电常数(,ε1 MHz)为2.69,介电损耗角正切(tanδ,1 MHz)为0.0032,吸水率为0.21%,能满足高性能PCB用树脂的要求。同时,对PEDM/烯丙基化PPO体系的非等温固化动力学进行了研究,并确定了该体系的固化工艺参数。As major resins of printed circuit board （PCB） with high performances, poly（phenylene oxide） （PPO） and polymaleimide （PMI） were first combined in this study. With weight of 10% of the PPO, a polymaleimide of bis（3-ethyl-4-maleimidophenyl） methane type （PEDM） was utilized as crosslink agent of the allylated PPO resin. By a thermopolymerization without initiating agent, a novel uniform and transparent thermosetting resin of PPO was obtained. Values of Tg, dielectric constant （ε,1MHz）, the dielectric loss tangent （tang, 1MHz） and water absorption of the cured PEDM/ PPO resin are determined to be 204.71℃, 2.69, 0.0032 and 0.21% ,respectively, which can meet the requirements of the PCB with high performances. Furthermore, values of curing reaction order （n） and apparent activation energy （Ea） of the PEDM/PPO resin were calculated to be 0.95 and 170.60 kJ/mol, respectively. Curing process parameters of the PEDM/PPO resin were obtained also.

关 键 词：聚苯醚 多马来酰亚胺 热固性树脂 改性 性能 

分 类 号：TQ326.53[化学工程—合成树脂塑料工业]