超短脉冲激光诱导单晶铜熔化的物理机制(英文)  

Physical mechanisms of ultrashort pulse laser induced melting in copper

作　　者：孟然[1] 刘璇[2] 周华[2] 

机构地区：[1]佳木斯大学机械工程学院,黑龙江佳木斯154007 [2]上海海洋大学工程学院,上海200090

出　　处：《强激光与粒子束》2008年第7期1084-1088,共5页High Power Laser and Particle Beams

基　　金：National Natural Science Foundation of China(60576064);Shanghai Science and Technology(0552nm033);National Basic Research Programof China(2006CB300406)

摘　　要：采用校正的分子动力学方法研究了超短脉冲熔化单晶铜的动力学微观机制,建模时将熔化潜热的消耗及自由电子的热传导均考虑在内,使熔化过程的模拟更加真实。皮秒激光熔化单晶铜是一种过热熔化,可归因于液相在固相中的均匀形核。熔沿传播的速度高达5.8 nm/ps,高于铜中声速。熔化发生在热约束区域内部,导致温度分布不太复杂,且卸载波对应力波的影响与应力约束区域相比较弱。The kinetics and microscopic mechanisms of ultrashort laser melting of a copper film is studied by modified molecular dynamics method. A model considering the thermal conductivity of free electrons and the consumption of latent heat of melting is used to make the simulation more realistic. The mechanism responsible for the melting of copper under picosecond laser pulse irradiation can be attributed to the homogeneous nucleation of the liquid phase inside the solid region. The melting is a overheated melting caused by homogeneous nucleation, and the velocity of propagation of ＂melt front＂ is found up to be 5.8 nm/ps. Picosecond laser pulse induced melting occurring under the condition of thermal confinement results in a less complicate temperature distribution and a weaker effect of unloading wave on stress wave compared with those in stress confinement region.

关 键 词：物理机制 熔化 皮秒激光脉冲 校正分子动力学 

分 类 号：TN249[电子电信—物理电子学] O552.6[理学—热学与物质分子运动论]