烧结温度对低温陶瓷结合剂性能的影响  

Influence of sintering temperature on performance of vitrified bond

作　　者：侯永改[1] 朱贺[1] 栗政新[1] 

机构地区：[1]河南工业大学材料科学与工程学院,河南郑州450007

出　　处：《超硬材料工程》2008年第4期14-17,共4页Superhard Material Engineering

摘　　要：文章研究了不同烧成温度下低温结合剂的烧结范围、强度、硬度,用XRD和SEM对不同烧成温度下陶瓷结合剂金刚石的结构进行了分析。结果发现:试验陶瓷结合剂在开始软化点725℃最适合陶瓷结合剂金刚石磨具的烧成,在该温度下烧成结合剂呈比较均匀的玻璃状态,对金刚石磨粒的润湿性好;在725℃烧成,结合剂的流动性为120%;结合剂试样的弯曲强度和洛氏硬度最大,分别为58.5M Pa和93.5(HRA)。In this paper, the authors studied sintering range, strength and hardness of low temperature vitrified bond at different sintering temperature and analyzed the structures by XRD and SEM. The results shown that it＇s suitable for sintering vitrified bond diamond grinding wheels at softening point 725℃ and diamond grits was bonded firmly by vitrified bond with uniform microstructure at this temperature. The fluidity, bending strength and hardness of vitrified bond was 120%, 58. 5MPa and 93. 5（HRA） respectively at 725℃ sintering temperature.

关 键 词：金刚石工具 烧结温度 陶瓷结合剂 流动性 

分 类 号：TQ174.4[化学工程—陶瓷工业]