冷轧纯铜微观组织及织构演变的特征  

MICROSTRUCTURE AND MICROTEXTURE EVOLUTION OF COLD ROLLING COPPER

作　　者：王雷[1] 李凡[1] 蒋建清[1] 

机构地区：[1]东南大学材料与工程学院,南京211189

出　　处：《理化检验（物理分册）》2008年第8期405-407,共3页Physical Testing and Chemical Analysis(Part A:Physical Testing)

摘　　要：介绍了电子背散射技术(EBSD)在材料织构方面的研究应用状况,并采用EBSD研究了纯铜在冷轧过程中晶粒的变化、晶粒取向及晶界角度分布的特征。结果表明,纯铜在经过大变形量后出现轧制织构,其轧制织构主要是{112}〈111〉和{011}〈112〉织构;在中小变形量下,随着变形量的增加大角度晶界逐渐减少,而到高变形量时逐渐增加。The application of EBSD （electron back-scatter diffrantion） is reviewed in materials microtexture study. Microtexture, boundary angle distribution and orientations in high purity copper cold rolled up to 96% （thickness reduction） were investigated. It was found that some special microtexture came forth in the pure copper after cold rolled and the mainly texture were { 112} （111）and{ 110} （112）. And the area fractions of boundary high angle were decreasing with the increase of deformation at low strain , while, increased at high strain with increasing cold rolling reduction.

关 键 词：电子背散射衍射技术 晶体取向 织构 

分 类 号：TG146.11[一般工业技术—材料科学与工程]