磁共振3D-CISS与CT高分辨率成像在电子耳蜗植入前的应用  

The role of MRI 3D-CISS and CT high-resolution imaging before implantation of electronic cochlea

作　　者：梁康福[1] 彭谦[1] 张小玲[1] 罗柏宁[1] 孟悛非[1] 叶滨宾[1] 

机构地区：[1]中山大学附属第一医院放射科,广东广州510080

出　　处：《解剖学研究》2008年第4期270-272,283,共4页Anatomy Research

摘　　要：目的利用中、内耳高分辨C计算机X线断层照相术(computed tomography,CT)扫描及磁共振(magnetic resonance imaging,MRI)高分辨3D-CISS序列成像对拟行人工耳蜗植入术的患者作术前检查,分析、比较两种方法的临床价值。方法选择30例拟行电子耳蜗植入的感音性耳聋患者。行中内耳CT高分辨放大扫描,层厚1mm,层间隔1mm,放大倍数2。磁共振高分辨率三维稳态干扰序列(three dimensional constructive inference insteady state,3D-CISS)扫描(TR12.30ms,TE5.9ms),翻转角70°,层厚0.7mm,无间隔扫描,最大信号强度投影(maximum intensity projection,MIP)内耳重建。比较两种方法提供的信息。结果CT可观察中耳内耳、骨性结构;MRI可显示内耳膜迷路情况及内听道的神经。结论将中、内耳螺旋CT高分辨成像与磁共振高分辨3D-CISS序列其联合应用可为人工耳蜗植入提供更精确可靠的术前信息。Objective High-resolution helical computerized tomography scan and MRI high-resolution 3D-CISS were performed on middle and inner ear on the patients with implantation of electronic cochlea preoperatively, the clinical values were analyzed and compared between them. Methods 30 deaf patients with planning of the implantation of electronic cochlea were chosen. High-resolution helical CT scan was performed with 1 mm thickness, 1 mm interslice gap, 2 times amplifination. MRI 3D-CISS sequence was performed （TR 12.30 ms,TE 5.9 ms） with flip angle 70°, slice thickness 0.7 mm, no gap, MIP reconstraction. The information from CT and MRI were compared. Results CT scans showed the structure of bony structure of middle and inner ear .MRI scans showed the membranous structure of middle and inner ear and nerves of inner acoustic meatus. Condusion The combination of High-resolution helical computerized tomography scan and MRI high-resolution 3D-CISS could provide more precise information for implantation of electronic cochlea.

关 键 词：磁共振成像 电子计算机断层成像 电子耳蜗 内耳 磁共振高分辨率三维稳态干扰序列 

分 类 号：R764[医药卫生—耳鼻咽喉科] R445[医药卫生—临床医学]