封套的传热模型与影响因素分析  

Heat Transfer Model of Envelope and Influencing Factor Analysis

作　　者：梁波[1,2] 易建政[1] 

机构地区：[1]军械工程学院静电与电磁防护研究所,石家庄050003 [2]72478部队,济南250310

出　　处：《包装工程》2008年第9期62-64,共3页Packaging Engineering

摘　　要：从封套所处的光热环境出发,在合理假设的基础上,构建了封套传热的数学模型,建立了封套表面的热流量方程和热平衡方程,并选取几组参数,进行了相关的数值计算。最后,依据计算结果分析了几种影响传入封套内热量的因素,并结合分析结果,提出了相应的防护措施,为后续封套防热方面的改进和防热试验的设计提供了一定的参考。The mathematical model of envelope heat transfer was established based on the light thermal environment of envelope and some rational assumption. The equations of heat flux and heat balance on envelope surface were established. According to several groups of selected parameter, correlative numerical value was calculated. A few factors affecting the heat transfer inside of the envelope were analyzed finally. Corresponding defend measures were put forward, which supplied some reference for the subsequent betterment and test on the envelope heat-prevention.

关 键 词：封套 光热环境 传热 数学模型 

分 类 号：TB487[一般工业技术—包装工程] TB485.5