无铅无镉快速化学镀Ni-P合金工艺  

Study on High Speed Ni-P Alloy Electroless Plating Technology in Lead-free and Cadmium-free Bath

作　　者：胡佩瑜[1] 成旦红[2] 李科军 郭国才[4] 曹铁华[1] 

机构地区：[1]上海大学环境工程系,上海200072 [2]中国浦东干部学院,上海201803 [3]上海杜美化工有限公司,上海200433 [4]上海应用技术学院,上海200235

出　　处：《电镀与精饰》2008年第9期39-42,共4页Plating & Finishing

摘　　要：研发一种新型的加速剂A和稳定剂S联合使用的无铅无镉的快速化学镀镍新工艺，镀速可达到30～38μm／h，所得镀层光亮、硬度高、孔隙率低，具有良好的结合力和耐腐蚀性。该工艺镀液稳定性和镀层性能在一定程度上已超过了含铅和镉的工艺。An En （electroless nickel） process in lead free and cadmium free bath was developed, in which a new accelerant A and a new stabilizer S were used to substitute for Pb and Cd, the deposition rate was 30 -38 μm/h. The EN plating is bright and it has low porosity, high hardness and high corrosion resistance. The technology stability and the plating properties are superior to the process in lead and cadmium containing bath to certain extent.

关 键 词：快速 铅 镉 化学镀M-P合金 

分 类 号：TQ153.2[化学工程—电化学工业]