平压平工艺参数对瓦楞纸板压痕过程影响分析  

Analysis of Influence of Flat-flat Technological Parameters on the Creasing Process of Corrugated Board

作　　者：周廷美[1] 高博[1] 闫琼[1] 

机构地区：[1]武汉理工大学机电工程学院,武汉430070

出　　处：《武汉理工大学学报》2008年第9期98-100,134,共4页Journal of Wuhan University of Technology

基　　金：教育部留学基金资助项目(20071108)

摘　　要：基于APDL(ANSYS Parametric Design Language)语言建立了瓦楞纸板仿真模型,运用接触分析及MPC(Mul-tipoint Constraint)技术,在考虑瓦楞纸板材料非线性及几何非线性的基础上,对瓦楞纸板压痕过程的不同工艺参数进行了模拟仿真,分析了不同工艺参数对压痕过程的影响,为完善工艺流程提供了依据。A corrugated board simulation model was built up based on the APDL（ANSYS Parametric Design Language）. Contact Analysis and MPC （Multipoint Constraint） technology is used in the course of creasing process simulation of corrugated board considering geometric non-linearity arid material non-linearity of corrugated board, influence of different technological parameters on the creasing process is analyzed, which provides a basis for improving the technological process

关 键 词：瓦楞纸板 工艺参数 压痕 非线性分析 

分 类 号：TS758[轻工技术与工程—制浆造纸工程]