置氢质量分数0.4% Ti600合金扩散连接  

Diffusion Bonding of 0.4% Mass Fraction Hydrogenated Ti600 Alloy

作　　者：张蕾[1] 滕俊飞[1] 侯金保[1] 

机构地区：[1]北京航空制造工程研究所102研究室,北京100024

出　　处：《材料工程》2008年第9期28-31,共4页Journal of Materials Engineering

摘　　要：进行了置氢质量分数0.4%的新型高温钛合金Ti600的真空扩散连接及接头力学性能测试,利用光学金相(OM)、扫描电镜(SEM)分析手段研究了连接工艺参数对界面孔洞弥合的影响以及拉伸断口特点。结果表明:氢元素能够显著提高扩散连接界面孔洞弥合率;随着连接温度的升高、连接时间的延长以及连接压力的增大,界面孔洞逐渐减少;当连接温度T=875℃,保温时间t=60min,焊接压力P=5MPa时,实现置氢Ti600的良好扩散结合,界面扩散孔洞消失;接头室温拉伸强度达1013MPa,为等条件下母材强度的96%,断口呈明显韧窝形貌。The diffusion bonding of hydrogenated Ti600 alloy containing mass fraction 0.4 % hydrogen and the mechanical property test were carried out. The diffusion holes close-up ration and fracture were investigated by means of optical metallographic microscope, scanning electron microscope. The results show that the hydrogen is beneficial to increasing the holes close-up ratio of Ti600 diffusion welding. With the diffusion bonding parameters increasing the diffusion holes decrease gradually. When bonded at 875℃ for 60min under a pressure of 5MPa, the diffusion holes disappeared and the tensile strength of the joint was up to 1013MPa, which reached 96% that of the base metal, and the fracture exhibited dimple pattern.

关 键 词：置氢Ti600 扩散连接 孔洞弥合率 拉伸强度 断口 

分 类 号：TG453.9[金属学及工艺—焊接]