半导体激光钎焊无铅钎料润湿铺展性能的研究  

Study on Wettability and Spreadability of Lead-free Solder with Diode Laser Soldering Process

作　　者：韩宗杰[1] 薛松柏[1] 王俭辛[1] 张亮 禹胜林[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《材料工程》2008年第9期76-79,共4页Journal of Materials Engineering

基　　金：江苏省普通高校研究生科研创新计划资助项目(CX07B_087z);江苏省“六大人才高峰”资助项目(06-E-020)

摘　　要：采用半导体激光软钎焊系统对Sn-Ag-Cu无铅钎料在Cu基体上进行了润湿铺展性能实验,研究了半导体激光工艺参数对Sn-Ag-Cu无铅钎料润湿铺展性能的影响规律。结果表明:随着激光输出功率的增加,无铅钎料的铺展面积逐渐增加,润湿角逐渐减小;当激光输出功率增加到某一特定范围时,无铅钎料的润湿铺展性能达到最佳。在一定的激光输出功率范围内,随着激光钎焊时间的增加,无铅钎料在Cu基体上的润湿铺展性能逐渐优化,并在激光钎焊时间达到一定值时达到最佳。当激光输出功率过低或过高时,无论怎样改变激光钎焊时间,液态钎料在Cu基体上的润湿铺展效果均很差。Wettability and spreadability of Sn-Ag-Cu lead-free solder on Cu substrate were tested by diode laser soldering system, influence of different soldering parameters on wettability and spreadability of Sn-Ag-Cu lead-free solder was studied. The results indicate that, as the laser output power increases, the spreading area of lead-free solder increases and the wetting angle decreases, the optimal wettability and spreadability is obtained while the laser output power increase to a certain range. Within a certain laser output power, the wettability and spreadability of Sn-Ag-Cu lead-free solder becomes better as the increase of laser soldering time, and it reaches the optimal state when the laser soldering time increase to a certain range. While the laser output power is too low or too high, the wettability and spreadability of Sn-Ag-Cu lead-free solder on Cu substrate is always poor whatever the laser soldering time is short or long.

关 键 词：半导体激光软钎焊 Sn-Ag—Cu无铅钎料 润湿铺展性能 

分 类 号：TG425.1[金属学及工艺—焊接] TG456.7