三点弯曲法测试微波烧结氧化锆陶瓷的断裂韧性值K_(IC)  

FRACTURE TOUGHNESS MEASUREMENTS OF MICROWAVE SINTERED ZIRCONIA BY THREE-POINT BENDING METHOD

作　　者：陈利祥[1] 

机构地区：[1]青岛大学物理系,青岛266071

出　　处：《青岛大学学报（自然科学版）》1997年第3期15-18,共4页Journal of Qingdao University(Natural Science Edition)

摘　　要：本文采用三点弯曲法测量了微波烧结氧化锆陶瓷的断裂韧性，并与压痕法的测量做了比较．同时也比较了微波烧结与常规烧结陶瓷材料的性能．The fracture toughness values of microwave sintered zirconia were measured by three-point bending method, and the results were compared with the indentation method. At the same time, the properties of conventionally sintered materials were also compared with that of microwave sintered.

关 键 词：微波烧结 断裂韧性值 氧化锆 陶瓷 三点弯曲法 

分 类 号：TQ174.758[化学工程—陶瓷工业]