耐高温对位芳纶纸基材料增强工艺的研究  

Study on reinforcement technology of heat-resistant para-aramid paper composite

作　　者：杨进[1] 周雪松[1] 胡健[1] 詹怀宇[1] 于天[1] 

机构地区：[1]华南理工大学制浆造纸工程国家重点实验室,广东广州510640

出　　处：《兵器材料科学与工程》2008年第5期33-37,共5页Ordnance Material Science and Engineering

摘　　要：对位芳纶纸基材料因其分子链刚性结构以及纤维表面化学惰性导致其力学性能较差,即使通过环氧树脂增强,其综合性能仍然不能达到航空航天等耐高温结构材料的要求。为了获得优异力学性能和耐高温性能的纸基材料,高强,高模及耐高温树脂聚酰亚胺作为增强树脂被采用,而其制品的力学性能受到成型加工工艺的影响。采用100℃预固化,250℃,20MPa热压成型的工艺将获得最佳力学性能,其裂断长达到8350m。通过DSC及TGA分析,其玻璃化转变温度及初始分解温度分别为275、550℃,有望作为航空航天等领域耐高温结构材料使用。Although epoxy resin plays the leading role in composite material, its long-time service temperature is below 150 ℃. In order to improve the service temperature and mechanical properties of para-aramid paper composite, study has been done on the advanced composite material using polyimide as reinforeed resin. The mechanical properties of para-aramid/polyimide composite vary with different processing technology. While pretreated at 100 ℃ and hot pressed under 20 MPa at 250℃ ,its fracture length reaches the maximum of 8 350 m. Moreover,the results of DSC and TGA analysis show that glass-transition temperature is 275℃ and initial decomposition temperature is 550 ℃.

关 键 词：对位芳纶 聚酰亚胺 浸渍 增强 

分 类 号：TS758[轻工技术与工程—制浆造纸工程]