聚合物表面自组装电极的制备  

Preparation of Electrodes Technique on Polymer Substrate Surface by Self-assembly Technique

作　　者：金永龙[1] 张宇[1] 顾宁[1] 

机构地区：[1]东南大学生物电子学国家重点实验室,江苏省生物材料与器件重点实验室,南京210009

出　　处：《高等学校化学学报》2008年第9期1859-1862,共4页Chemical Journal of Chinese Universities

基　　金：国家自然科学基金重点项目(批准号:90406023);中国博士后基金(批准号:20060400904);江苏省博士后科研资助计划(批准号:0601013B);南京大学固体微结构国家重点实验室开放课题资助

摘　　要：采用在聚合物表面制备选择性化学镀电极的方法,将具有电极结构的模板置于聚萘二甲酸乙二醇酯(PEN)基片表面上,用紫外光进行照射,使辐照区域表面形成羧基,然后通过配位作用使银离子附着到表面上,再经过紫外光照射还原出金属银颗粒,最后以表面的金属银颗粒为催化剂进行特定区域化学镀铜形成电极.利用四探针法测得电极的电阻率为5.063×10-2Ω.mm2/m,与纯金属铜的电阻率的数量级相同.Electrode fabrication on polymer substrates surface is very important for developing many devices such as flexible thin film transistors, large area displays, electronic tags and biochemical sensors etc. In this paper, we report on direct fabrication of copper electrodes on polymer substrate surface by molecular self-assembly technique. The process involved the UV-irradiation of the polyethylene naphthalate （PEN） surface to introduce carboxyl groups and subsequent adsorption of silver ions, which were then reduced by UV-irradiation to form silver particles as the seeds to catalyze chemical deposition of copper. Using a photomask, the copper electrodes could be successfully fabricated on the selected surface sites. So the obtained copper electrodes possess an electric resistivity of 5. 063 × 10^-2 Ω· mm2/m, which is on the same order of magnitude as pure metal copper. This method is simple and convenient, which provides a very good way for fabricating electrodes on polymer substrate.

关 键 词：自组装技术 聚合物 电极 聚萘二甲酸乙二醇酯 

分 类 号：O644.1[理学—物理化学] O647[理学—化学]