薄板粘接结构界面力学模型和数值模拟  

Cohesive Interface Mechanical Model and Simulation of Bonding Structure

作　　者：贾宏[1] 张军[1] 黄刘刚[1] 

机构地区：[1]郑州大学化学工程学院,郑州450001

出　　处：《科技导报》2008年第16期64-67,共4页Science & Technology Review

摘　　要：在各种界面力学模型基础上,研究了张力-位移界面本构关系的粘接界面力学模型,应用有限单元方法对粘接结构进行了计算,分别模拟了剥离和剪切的界面开裂过程,描述粘接界面从起始剥离到完全开裂过程的力学性能,得到两种情况下的粘接界面开裂的强度曲线。This paper studied the calculation interface model and damage criterion based on traction-separation law. The FEM was used to calculate the bonding structure. The peeling and cuting of bongding structure were simulation which describes the relation between traction and displacement on the interface from initiation damage to overall damage. The strength curves were gained for bonding interfacial damages of the two things.

关 键 词：粘接结构 界面模型 本构关系 

分 类 号：TG491[金属学及工艺—焊接]