微通道板显微结构缺陷及机理研究  

Microstructure defects of microchannel plate and its mechanism

作　　者：王益军[1] 严诚[2] 丛晓庆[2] 张正君[2] 孙建宁[2] 赵慧民[2] 

机构地区：[1]西北工业大学理学院 [2]北方夜视技术股份有限公司,北京100089

出　　处：《光学技术》2008年第5期670-673,共4页Optical Technique

基　　金：总装预研项目(4040505101B)

摘　　要：采用实芯工艺制备了微通道板,利用光学显微镜、SEM、EDS对微通道板结构缺陷的显微形貌和成分进行了分析,采用线胀系数和粘度测定仪测试了微通道板玻璃材料的物理特性。分析了产生复丝分离、亮点、污染点等结构缺陷的主要工艺因素。结果表明:复丝分离是由于实体边玻璃的变形温度(TS)低所引起,复丝边界的亮点由夹杂物产生,夹杂物主要是由复丝的玻璃粉屑形成。由于复丝分离和夹杂物的存在,使得抛光时复丝边界引入CeO2,形成污染点。提出了通过选用变形温度为655℃实体边材料,减少复丝表面微米级污染物等方法减少结构缺陷。Microchannel plate is prepared by solid core process. The micrograph morphology and composition of microstructure defects on microchannel plate （MCP） are measured and characterized by optical microscope, scanning electron microscope and X-ray energy dispersion spectroscopy （X-EDS）. The physical properties of glass materials of MCP are measured by linear expanding coefficient and viscosity determinator. The process factors, which can cause microstructure defects such as muhifilament separation, bright spot, polluted site etc, are analyzed. The results show that multifilament separation is caused by lower sag temperature （Ts） of solid glass. The bright spot in multifilament boundary is caused by inclusion which comes from powder of multifilament glass. Because of multifilament boundary and inclusion, CeO2 will adhesion and contain in those microstructure defects which can cause polluted site. The means, such as using higher softening point solid glass which sag temperature at 655℃, and decreasing surface micron-size pollutants on multifilament are put forward to reduce microstructure defects.

关 键 词：应用光学 微通道板 显微结构 显微缺陷 EDS 

分 类 号：TN223[电子电信—物理电子学]