微孔草叶组织热伤害的研究  

Study on Hot Damage to Leaf Tissue of Microula Sikkimensis

作　　者：王钦[1] 付华[1] 韩扬[1] 

机构地区：[1]甘肃省草原生态研究所

出　　处：《甘肃农业大学学报》1997年第4期370-375,352,共7页Journal of Gansu Agricultural University

基　　金：甘肃省自然科学基金

摘　　要：用电导法测量微孔草叶组织热伤害的电解质渗出量，计算出细胞伤害率，并配以Ｌｏｇｉｓｔｉｃ方程求得拐点温度，估测热伤害的半致死温度是０５ｈ处理为４９℃，１ｈ处理为４８℃，１５ｈ处理为４６℃。Electrolyte filtration amounts in leaf tissue of microula sikkimensis by hot damage can be measured with conductivity method. With logistic equation cell damage rate and turn point temperature can be obtained. The semi lethal temperature hot damage is 0.5 h for 49℃, 1 h for 48℃, and 1.5 h for 46℃ respectively.

关 键 词：微孔草 叶组织 热伤害 环境温度 

分 类 号：S812.3[农业科学—草业科学] S428[农业科学—畜牧学]