信号传输高频化和高速数字化对PCB的挑战(1)——对导线表面微粗糙度的要求  

The Challenge of Signal Transmission in High Frequency and High-speed Digitization(1)——The Requirement of Surface Micro-roughness

作　　者：林金堵[1] 

机构地区：[1]CPCA

出　　处：《印制电路信息》2008年第10期15-18,共4页Printed Circuit Information

摘　　要：文章概述了信号传输的高频化和高速数字化的发展,趋肤效应越来越严重地影响着电气性能。因此PCB导体的粗糙度必须越来越小,常规的表面氧化技术是越来越不能采用了,必须采用物理化学方法来提高界面的结合力。The paper describes that the development of signal transmission ofhigh frequence and high-seed digitization.The electric performance is affected by trend-skin effect.Therefore,It is required to surface micro-rough- ness of conductive .It is not used the traditional technology of chemical oxidation.The high- boundaryadberence must be applied with other physical-chemistry.

关 键 词：信号传输 表面粗糙度 趋(集)肤效应 界面结合力 粉红圈 离子迁移/CAF 

分 类 号：TN41[电子电信—微电子学与固体电子学]