pH对钢铁基体焦磷酸盐镀铜结合力的影响  

Influence of pH on Adhesion of Copper Coating in Pyrophosphate Copper Plating on Iron Substrate

作　　者：汪龙盛[1] 王春霞[1] 李干湖[1] 

机构地区：[1]南昌航空大学材料科学与工程学院,江西南昌330063

出　　处：《电镀与精饰》2008年第10期34-36,共3页Plating & Finishing

摘　　要：测试了在焦磷酸盐镀铜溶液中不同pH时的铜和铁的稳定电位以及阴极极化曲线,结果表明铜的稳定电位随pH升高而变负,铁的稳定电位随pH升高而变正;铁的阴极极化作用随着pH升高而减弱。并初步探讨了不同pH对镀层结合力的影响,结果表明当严格控制镀液pH时镀层结合力良好。The open circuit potential- time curve of copper and iron and the cathode polarization curve with different pH was tested with the CHI660A. The results display that when pH value goes up, the open circuit potential of copper goes down, the open circuit potential of iron goes up, and the cathode polarization weakens. The influence of pH on the bonding strength was studied. The results display that when the pH is controlled in an-appropriate rang, the bonding strength of copper coating on iron substrate is higher enough.

关 键 词：焦磷酸盐镀铜 置换 极化 结合力 

分 类 号：TQ153.14[化学工程—电化学工业]