低温共烧(LTCC)微波介质陶瓷的研究进展  

Research Progress in Low Temperature Co-firing of Microwave Dielectric Ceramics

作　　者：郑振中[1] 甘国友[1] 严继康[1] 郭宏政[1] 唐荣梅[1] 王立惠[1] 

机构地区：[1]昆明理工大学材料与冶金工程学院,昆明650093

出　　处：《材料导报（纳米与新材料专辑）》2008年第2期322-324,328,共4页

摘　　要：描述了低温共烧(LTCC)技术与微波介质陶瓷的关系,综述了近年来微波介质陶瓷在低温烧结方面的研究进展,介绍了几种能获得具有低温烧结的微波介质陶瓷的方法,指出了低温共烧(LTCC)技术对微波介质陶瓷的要求。In this paper the relation between microwave dielectric ceramics and low-temperature co-firing （LTCC） technology is described. The recent progress in the studies of low-temperature firing in microwave dielectric ceramics is reviewed. Some methods are introduced to reduce the sintering temperature of dielectric ceramics, and the requirements of microwave dielectric ceramics to the low-temperature co-firing （LTCC） technology are pointed out.

关 键 词：低温共烧(LTCC) 微波介质陶瓷 掺加 助烧剂 

分 类 号：TQ174.756[化学工程—陶瓷工业] TQ174.758[化学工程—硅酸盐工业]