镍磷锗对SnAgCuCe系钎料性能及组织的影响  

Effects of NiPGe on the properties and structure of SnAgCuCe solders

作　　者：董文兴[1] 史耀武[1] 雷永平[1] 夏志东[1] 郭福[1] 

机构地区：[1]北京工业大学材料学院,北京100124

出　　处：《电子元件与材料》2008年第10期70-73,共4页Electronic Components And Materials

基　　金："十一五"国家科技支撑重点资助项目(No.2006BAE03B02);北京市属市管高等学校人才强教计划资助项目

摘　　要：为改善Sn3.0Ag0.5CuCe(SAC305Ce)无铅钎料的性能,向其添加了微量Ni、P及Ge并进行了研究。结果表明,同时添加质量分数为0.10%Ni、0.01%P和0.05%Ge,150℃时效168h后,钎料综合性能最佳。钎料合金组织中共晶组织的分布较为密集,IMC厚度有轻微增加,润湿力约0.48mN,剪切强度约62MPa。For improving properties of Sn3.0Ag0.5CuCe（SAC305Ce） lead-free solder, it was added micro amounts of Ni, P and Ge, and its studies were carried out. Results show, adding mass fractions of 0.10% Ni, 0.01%P and 0.05%Ge at a time, the comprehensive property of the solder is the best. After aging 168 h at 150℃, the distribution of eutectic structure is dense and IMC thickness increase slightly, wet force is about 0.48 mN, shear strength is about 62 MPa.

关 键 词：电子技术 Sn3.0Ag0.5CuCe钎料 微量元素添加 显微组织 

分 类 号：TM931[电气工程—电力电子与电力传动]