钨铜合金化学镀镍磷镀层在NaCl溶液中的腐蚀行为  

CORROSION BEHAVIOR OF Ni-P DEPOSIT ON W-Cu ALLOY IN NaCl SOLUTION

作　　者：郝龙[1] 李锐[1] 江莉[1] 林安[1] 甘复兴[1] 

机构地区：[1]武汉大学资源与环境科学学院环境工程系,武汉430079

出　　处：《中国腐蚀与防护学报》2008年第5期307-310,共4页Journal of Chinese Society For Corrosion and Protection

摘　　要：采用化学沉积的方法在W-Cu粉末合金上成功地实现了化学镀Ni-P镀层,镀层表面光滑、致密,在结构上属于非晶态;经过25 d的3.5 mass%NaCl溶液浸泡研究表明:在浸泡的前16 d中,化学镀Ni-P镀层的腐蚀速率逐渐增大,在16 d之后腐蚀倾向有所降低;通过腐蚀失重实验得到Ni-P镀层的腐蚀失重小于W-Cu合金,说明化学镀Ni-P镀层可以对W-Cu合金起到保护作用。Electroless Ni-P deposition on W-Cu alloy was prepared by electroless plating, and the surface is compact and smooth with amorphous structure. The corrosion behavior of electroless Ni-P deposit in 3.5mass% NaCI solution for 25d indicates： The corrosion tendency of electroless Ni-P deposit is strong during the first 16 days immersion in NaCI solution, in contrast, the corrosion tendency becomes weak after 16 days immersion. The weight loss test shows the corrosion posit can provide enough protection rate of Ni-P deposit is smaller than the to W-Cu alloy. W-Cu alloy, indicating that Ni-P deposit can provide enough protection to W-Cu alloy.

关 键 词：钨铜合金 化学镀 Ni—P镀层 腐蚀 

分 类 号：TG[金属学及工艺]