组合材料芯片技术在Zn-Al合金镀层组分优选中的应用  

Composition Optimization of Zn-Al Hot-Dip Coatings Using Combinatorial Material Chip Approach

作　　者：朱丽慧[1] 朱烁金[1] 刘茜[2,3] 刘庆峰[2,3] 王利[4] 

机构地区：[1]上海大学材料科学与工程学院,上海200072 [2]中国科学院上海硅酸盐研究所,上海200050 [3]高性能陶瓷和超微结构国家重点实验室,上海200050 [4]宝山钢铁股份有限公司技术中心,上海201900

出　　处：《上海大学学报（自然科学版）》2008年第5期492-497,共6页Journal of Shanghai University:Natural Science Edition

基　　金：上海市科委重大科技攻关资助项目(055211005)

摘　　要：组合材料芯片技术是材料研究的一种全新方法，能够高效、快速地筛选、优化新材料．按照组合材料芯片技术筛选结果，具有良好力学和耐蚀性能的Zn—Al合金中Al含量应控制在50％～75％，其中Al含量为72．6％时性能最佳．选择纯锌、55Al-Zn和72Al-Zn三种组分进行热浸镀和耐蚀性比较及机理研究．结果表明，72Al-Zn合金的耐蚀性稍优于55Al-Zn，都明显优于纯锌．这与组合材料芯片技术筛选结果一致，表明该组合材料芯片技术在优选Zn—Al耐蚀合金镀层组分方面是可靠的．Combinatorial material chip approach is innovation in materials research. It can discover and optimize new materials efficiently and quickly. Combinatorial material chip approach suggests that Al content should be controlled in the range of 50% - 75% for Zn-Al hot-dip coatings with good mechanical properties and anticorrosion behavior. Especially, 72. 6Al-Zn has excellent properties. Corrosion behaviors of hot-dip Zn, 55Al-Zn and 72Al-Zn coatings were compared and the corrosion mechanisms were studied. The results show that the anticorrosion property of 72Al-Zn coating is slightly better than 55Al-Zn coating, and both are much better than Zn coating. It indicates that combinatorial material chip approach can be applied for the composition optimization of anticorrosion Zn-Al hot-dip coatings.

关 键 词：组合材料芯片技术 热浸镀锌 耐蚀性 

分 类 号：TG146.21[一般工业技术—材料科学与工程] TB43[金属学及工艺—金属材料]