铍青铜接插件电镀耐磨金  

Were-RESISTING ELECTROPLATION ON BE-BRONZE CONNECTOR

作　　者：胡培荣[1] 顾志平 丁家铭 杨晓东 

机构地区：[1]苏州大学化学化工学院,苏州215006 [2]陕西853厂电镀分厂

出　　处：《苏州大学学报（自然科学版）》1997年第4期105-108,共4页Journal of Soochow University(Natural Science Edition)

摘　　要：本文着重叙述了铍青铜的前处理工艺,电镀耐磨金的电镀液配方和工艺条件,及采用良好的活化处理以确保镀金层与光亮镍层的结合力。尤其是电镀耐磨金工艺,引入了原子量较小的金属元素,代替常见的金钴、金锢、金镍等合金体系,有效地改善了镀层的耐磨性能和结合力。经长期使用、完全能满足接插件行业(军工产品)的需要。The pretreatment technology of Be-bronze and the prescription of electroplating bath and the process conditions on electroplation of wear-resistant gold were studied in the paper. A desirable activation treatment was used to ensure the combined force between gold-electroplation coating and bright nickel coating. The wear-resistant performance and the combined force were improved effectively metallic elements with smaller atomic weight instead of general Au-Co, Au-In and Au-Ni alloy system in the wear-resistant electroplatimg technology, by means of the technology can meet throughly the need of connecticinsertion attachment product or onits miliary product.

关 键 词：铍青铜 电镀 金 耐磨性能 结合力 接插件 

分 类 号：TQ153.18[化学工程—电化学工业]