导电陶瓷Ti_3SiC_2颗粒表面无敏化活化的化学镀铜  

Electroless Copper Plating on Ti_3SiC_2 Surface Without Activation and Sensitization

作　　者：赵清碧[1] 许少凡[1] 江沣[1] 袁传勇[1] 

机构地区：[1]合肥工业大学,安徽合肥230009

出　　处：《稀有金属快报》2008年第10期32-35,共4页Rare Metals Letters

摘　　要：利用无敏化、活化的化学镀覆技术能成功地在Ti3SiC2颗粒表面均匀地化学镀铜。实验表明:镀前对陶瓷颗粒进行严格的粗化处理,使其表面具有很强的催化中心,通过采用合适的镀液配方和工艺,能成功地在Ti3SiC2颗粒表面镀覆一层铜,从而增强了陶瓷Ti3SiC2颗粒和铜基体之间的界面结合力,为Ti3SiC2在复合材料领域中的应用开辟了更广阔的前景。Ti3SiC2 particle surface was successfully coated with copper by electroless plating method without sensitization and activation. Experiments show that by strict coarsening handling before electroless plating the ceramic particle surface has a strong catalytic center, a layer of continuous copper on surface of Ti3SiC2 can be successfully coated through appropriate solution formulation at certain process conditions. Thus the interfacial adhesion between Ti3SiC2 and copper matrix of the composite coating can be increased, which has laid a solid foundation for the application of Ti3SiC2 in areas of the composite material.

关 键 词：导电陶瓷Ti3SiC2 化学镀 无敏化活化 界面结合力 

分 类 号：TG134.453[一般工业技术—材料科学与工程]