浆料成分对银导体浆料性能的影响  

Effects of Slurry Composition on Properties of Silver Conductor Slurry

作　　者：江成军[1] 张振忠[1] 赵芳霞[1] 段志伟[1] 王超[1] 

机构地区：[1]南京工业大学材料科学与工程学院

出　　处：《特种铸造及有色合金》2008年第10期804-806,共3页Special Casting & Nonferrous Alloys

基　　金：国家自然科学基金资助项目(10502025);江苏省高校自然科学基金资助项目(05KJB1300421)

摘　　要：试验以直流电弧等离子体法自制的超细银粉为原料,通过改变浆料各成分配比,结合金相显微镜、EDS等分析手段,研究了各成分对最终烧成厚膜导体性能的影响。结果表明,浆料的粘度随固含量的增加而增大,试验推荐固含量为80%;在试验范围内,导体方阻随着玻璃粉的含量呈现先减小后增大的趋势,推荐玻璃粉最佳含量为3%;玻璃粉粒径与Ag粒径对导体浆料的性能均有影响,对于导电性能而言,不同粒径Ag粉与玻璃粉之间存在最佳组合。对可焊性而言,平均粒径为102.92、204.26nm的Ag粉具有良好的可焊性,玻璃粉粒径对可焊性也有一定影响。Silver films were made by thick film method with ultrafine silver powders prepared by DC(direct current) arc plasma evaporation. Effects of slurry compositions on the properties of the silver conductor with thick film had been investigated by varying proportion of slurry composition with the help of OM, EDS. The results indicate that the slurry viscosity is increased with the increase of solid phase content, and the optimized solid phase content is 80%. At the experimental range, the sheet resistance of the sintered thick film is firstly decreased, then increased with increasing in glass powder content, and desirable glass content is 3%. In addition, sizes of glass powder and Ag powder have evidently affected the properties of Ag conductor slurry. There exists a desirable match in Ag powder and glass powder for conductivity. The Ag powder with average size of 102.92 nm and 204.26 nm exhibits good solderability, and size of glass powder also affects the solderability of silver conductor with thick film to some extent.

关 键 词：超细银粉 厚膜导体浆料 性能 

分 类 号：TN304[电子电信—物理电子学]